Finished AOI

Features

· Precise numerical control integrated surface RGB shadowless light source

· All imported 10 million-pixel industrial cameras and lenses

· The equipment structure is highly integrated, easy to install and maintain, and the interface is easy to operate

· Online detection, seamless connection with production line MES

· The three-color algorithm truly restores the color of the cells and realizes high-precision color sorting of the cells

· Artificial intelligence technology realizes battery defect classification

· Big data analysis of defect distribution and defect cell distribution


Color imaging solution: use black and white CCD chip + RGB light source (same as GP)

· The number of red, green and blue photosensitive pixels is 25 million

· True color reproduction, high sensitivity, good contrast

· Natural black and white mode, more accurate color inspection and more advantages in defect detection

· Imaging is not affected by the color temperature of the light source (or ambient light)

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Other competing imaging solutions: use color CCD chip + white light source

· Colors are formed by interpolation, not truecolor

· The number of red and blue photosensitive pixels accounts for 25%, which is equivalent to 6 million

· The number of green light-sensitive pixels accounts for 50%, which is equivalent to 12 million

· The color is not bright enough, and the color gamut is limited

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Imaging effect & comparison of advantages and disadvantages


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Plan

Three-color light + black and white cameraMonochromatic light + color camera
Number of photos3 photos1 photo
CT (photographing + processing)850ms

600ms

Treatment (color, shape, graphics, defects)

Synchronous processing, CT does not increase with detection items

Serial processing, type increase CT increase

AlgorithmRuili color, accurate sorting: easy to detect surface contamination under red light (such as watermarks)

The color is not bright enough, and the slight surface contamination cannot be recognized

Process convenience

Product switching without changing the underlying

algorithm

Product switching needs to change the underlying

algorithm


Device parameters


ProjectSpecification

Equipment ruler

Length 430mm Width 390mm Height 780mm
Applicable Wafer Size156*156mm- 170*170mm
Applicable Wafer Type

Monocrystalline, polycrystalline, diamond wire monocrystalline, polycrystalline, PERC cells

Production capacityUp to 3800PCS/hour
Front camera pixels/resolution25 million, 34um
Rear Camera Pixels/Resolution

20 million, 48um (optional 25 million configuration for easy product upgrade)

UPTime>99%
False positive rateAs low as <1%

False negative rate

As low as <0.1

Fragmentation rate

0%


Test itemsdefect type
size measurement

Side lengths, bends, diagonals, etc.

Damage detectionDamage, edge chipping, missing corners, grid line damage, cracks, etc.
printing offsetIncluding overall offset, grid line offset, main grid offset, etc.
Grid detection

Including broken grid, thinning, thickening, twisting, virtual printing, etc.

Dirt detectionContains fingerprints, watermarks, screen dirt, etc.
Spot detectionBright blue spots, small spots, white spots, dark red spots, slurry leakage, fingerprints, dripping oil, uncoated, diffusion boat prints, etch stains, etc.

Line Mark

Detection

The grid line becomes thicker at the position where the scratch-like defect appears on the grid line

overshoot

detection

Excessive etching on the surface of the product causes dark yellow or dark red color difference

Color difference

detection

Single chip color difference, black silk chip, flower chip, light and dark chip, intra-chip color difference


Test items

defect type

size measurementSide lengths, bends, diagonals, etc.
electrode offset

Including up and down offset, left and right offset, etc.

Electrode

detection

Including electrode missing, damaged, warped, etc.
Dirt detectionContains stains, fingerprints, oil stains, etc.
Spot detectionmacula, plaque etc.

Color difference

detection

In-chip chromatic aberration, yellowing, etc.



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